Park Electrochemical Corp., a global advanced materials company which develops and manufactures high-technology digital and microwave printed circuit materials, has announced the launch of its new E-752-LT toughened 350°F (177°C) cure epoxy resin system for Automated Fibre Placement (AFP) processing.

E-752-LT is designed for aerospace primary and secondary structural applications and is available in standard modulus and intermediate modulus precision slit tapes and fabrics. The resin system has been formulated to optimize efficient processing in AFP applications for high volume manufacturing. It offers a combination of toughness, low moisture absorption and very good mechanical properties, Park said in a statement.

Park Electrochemical Corp. works principally for the telecommunications and internet infrastructure and high-end computing markets and advanced composite materials, parts and assemblies and low-volume tooling for the aerospace markets. Park’s core capabilities are in the areas of polymer chemistry formulation and coating technology. (GK)